A 17 Gb/s, 200-meter multimode optical fiber link using CMOS analog ICs and silicon carrier packaging

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

Volumn , Issue , 2006, Pages 573-574

  Liboiron Ladouceur, O ^a,b   Schow, C L ^b   Pepeljugoski, P K ^a,b   Doany, F E ^b   John, R A ^b   Kash, J A ^a,b  

^a IEEE

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; MULTIMODE FIBERS; OPTICAL LINKS;

SILICON CARRIER PACKAGING;

OPTICAL COMMUNICATION;

EID: 39049144237     PISSN: 10928081     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/LEOS.2006.278788     Document Type: Conference Paper

References (5)

1. L. Schares et al., "Terabus: TB/s-class Card-level Optical Interconnect Technologies," IEEE J. Sel. Topics Quantum Electron., in press.
2. J.U. Knickerbocker et al., "Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology," IEEE CICC, pp. 659-662, September 2005.
3. Kucharski et al., "A 20 Gb/s VCSEL driver with pre-emphasis and regulated output impedance in 0.13um CMOS," IEEE ISSCC, pp. 222-223, February 2005.
4. C.L. Schow et al., "A 15-Gb/s, 2.4-V Optical Receiver Using a Ge-on-SOI Photodiode and a CMOS IC," IEEE Photon. Technol. Lett., in press.
5. P.K. Pepeljugoski et al., "15.6-Gb/s Transmission Over 1 km of Next Generation Multimode Fiber," IEEE Photon. Technol. Lett., vol. 14, pp. 717-719, May 2002.