Evaluating and controlling silicon wafer slicing quality using fuzzy analytical hierarchy and sensitivity analysis

International Journal of Advanced Manufacturing Technology

Volumn 36, Issue 3-4, 2008, Pages 322-333

  Chang, Che Wei ^a   Wu, Cheng Ru ^a   Lin, Chin Tsai ^a   Chen, Huang Chu ^a  

^a YUANPEI UNIVERSITY   (Taiwan)

Author keywords

EWMA; Fuzzy analytical hierarchy process; Sensitivity analysis; Wafer slicing

Indexed keywords

ANALYTIC HIERARCHY PROCESS; FUZZY SYSTEMS; SEMICONDUCTOR DEVICE MANUFACTURE; SENSITIVITY ANALYSIS;

FUZZY ANALYTICAL HIERARCHY PROCESS; WAFER SLICING;

SILICON WAFERS;

EID: 39049117304     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-006-0831-9     Document Type: Article

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