-
2
-
-
0001048179
-
-
K. Suganuma, MRS Bull., 26 (2001) 880-884.
-
(2001)
MRS Bull
, vol.26
, pp. 880-884
-
-
Suganuma, K.1
-
3
-
-
28444454389
-
Issues in the replacement of leadbearing solders
-
P.T. Vianco and D.R. Frear: Issues in the replacement of leadbearing solders, JOM 45, (1993) 14-19.
-
(1993)
JOM
, vol.45
, pp. 14-19
-
-
Vianco, P.T.1
Frear, D.R.2
-
4
-
-
84875815403
-
Developing lead-free solders: A challenge and opportunity
-
S. Jin, Developing lead-free solders: A challenge and opportunity, JOM 45, 13 (1993)
-
(1993)
JOM
, vol.45
, pp. 13
-
-
Jin, S.1
-
5
-
-
0029193520
-
Metallurgy of low temperature Pb-free solders for electronic assembly
-
J. Glazer: Metallurgy of low temperature Pb-free solders for electronic assembly. Int. Mater Rev. 40 (1995) 65.
-
(1995)
Int. Mater Rev
, vol.40
, pp. 65
-
-
Glazer, J.1
-
6
-
-
0033747819
-
Lead-free solders in microelectronics
-
M. Abtew and G. Selvaduray, Lead-free solders in microelectronics, Mater Sci. Eng. 27 (2000) 951.
-
(2000)
Mater Sci. Eng
, vol.27
, pp. 951
-
-
Abtew, M.1
Selvaduray, G.2
-
8
-
-
38949083105
-
-
U.S. Patent No. 5,527,628, June 18
-
I.E. Anderson, F.G. Yost, J.F. Smith, C.M. Miller, R.L. Terpstra, U.S. Patent No. 5,527,628, June 18, 1996.
-
(1996)
-
-
Anderson, I.E.1
Yost, F.G.2
Smith, J.F.3
Miller, C.M.4
Terpstra, R.L.5
-
9
-
-
0034297162
-
-
K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, C.A. Handwerker, J. Electron. Mater. 29 (2000) 1122.
-
(2000)
J. Electron. Mater
, vol.29
, pp. 1122
-
-
Moon, K.-W.1
Boettinger, W.J.2
Kattner, U.R.3
Biancaniello, F.S.4
Handwerker, C.A.5
-
11
-
-
3242806751
-
-
S.K. Kang, D.-Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S-I. Cho, J. Yu, W.K. Choi, JOM 56(6) (2004) 34-38.
-
(2004)
JOM
, vol.56
, Issue.6
, pp. 34-38
-
-
Kang, S.K.1
Shih, D.-Y.2
Leonard, D.3
Henderson, D.W.4
Gosselin, T.5
Cho, S.-I.6
Yu, J.7
Choi, W.K.8
-
12
-
-
25844438737
-
-
S.K. Kang, P.A. Lauro, D.-Y. Shih, D.W. Henderson, K.J. Puttlitz, IBM J. Res. Dev. 49(4/5), (2005) 607-620.
-
(2005)
IBM J. Res. Dev
, vol.49
, Issue.4-5
, pp. 607-620
-
-
Kang, S.K.1
Lauro, P.A.2
Shih, D.-Y.3
Henderson, D.W.4
Puttlitz, K.J.5
-
13
-
-
38949201623
-
-
http://www.metallurgy.nist-gov/phase/solder/solder.html
-
-
-
-
18
-
-
25844438737
-
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
-
S.K. Kang, P.A. Lauro, D.Y. Shih, D.W. Henderson, K.J. Puttlitz, Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications, IBM Journal of Research and Development, 49 (4/5) (2005) 121.
-
(2005)
IBM Journal of Research and Development
, vol.49
, Issue.4-5
, pp. 121
-
-
Kang, S.K.1
Lauro, P.A.2
Shih, D.Y.3
Henderson, D.W.4
Puttlitz, K.J.5
|