MPSA effects on copper electrodeposition investigated by molecular dynamics simulations

Journal of Chemical Physics

Volumn 128, Issue 4, 2008, Pages

  Guymon, Clint G ^a,b   Harb, John N ^a   Rowley, Richard L ^a   Wheeler, Dean R ^a  

^a Brigham Young University   (United States)

^b Safety Management Services   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MOLECULAR FUNCTIONS; ORGANIC ADDITIVES; SURFACE ADSORPTION;

ADSORPTION; ASPECT RATIO; COMPUTER SIMULATION; COPPER; ELECTRODEPOSITION; MOLECULAR DYNAMICS; SODIUM CHLORIDE;

OPTICAL INTERCONNECTS;

EID: 38849136694     PISSN: 00219606     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2824928     Document Type: Article

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