-
1
-
-
0031166167
-
Moore's Law: Past, Present, and Future
-
Schaller, R. R., 1997, "Moore's Law: Past, Present, and Future," IEEE Spectrum, 34(6), pp. 52-59.
-
(1997)
IEEE Spectrum
, vol.34
, Issue.6
, pp. 52-59
-
-
Schaller, R.R.1
-
2
-
-
85199282868
-
-
International Technology Roadmap for Semiconductors, 2004 ed., Semiconductor Industry Association.
-
International Technology Roadmap for Semiconductors, 2004 ed., Semiconductor Industry Association.
-
-
-
-
3
-
-
0030388567
-
Cooling of Electronics by Heat Pipes and Thermosyphons: A Review of Methods and possibilities
-
Houston, TX, ASME
-
Palm, B., and Tengblad, N., 1996, "Cooling of Electronics by Heat Pipes and Thermosyphons: A Review of Methods and possibilities," Proceedings of the 31st National Heat Transfer Conference, Houston, TX, ASME, Vol. 7, pp. 97-108.
-
(1996)
Proceedings of the 31st National Heat Transfer Conference
, vol.7
, pp. 97-108
-
-
Palm, B.1
Tengblad, N.2
-
4
-
-
0024719202
-
The ETA 10 Liquid-Nitrogen-Cooled Supercomputer System
-
Carlson, D. M., Sullivan, D. C., Bach, R. E., and Resnick, D. R., 1989, "The ETA 10 Liquid-Nitrogen-Cooled Supercomputer System," IEEE Trans. Electron Devices, 36(8), pp. 1404-1413.
-
(1989)
IEEE Trans. Electron Devices
, vol.36
, Issue.8
, pp. 1404-1413
-
-
Carlson, D.M.1
Sullivan, D.C.2
Bach, R.E.3
Resnick, D.R.4
-
5
-
-
1242328132
-
High-End Low-Temperature Server Cooling
-
Schmidt, R. R., and Notohardjono, B. D., 2002, "High-End Low-Temperature Server Cooling," IBM J. Res. Dev., 46(6), pp. 739-754.
-
(2002)
IBM J. Res. Dev
, vol.46
, Issue.6
, pp. 739-754
-
-
Schmidt, R.R.1
Notohardjono, B.D.2
-
6
-
-
25844448084
-
The Urgency of Deep Sub-Ambient Cooling for Gigascale Integration
-
Austin, TX, IEEE, pp
-
Naeemi, A., Joshi, Y., Fedorov, A., Kohl, P., and Meindl, J. D., 2005, "The Urgency of Deep Sub-Ambient Cooling for Gigascale Integration," IEEE International Conference on Integrated Circuits Design and Technology, Austin, TX, IEEE, pp. 171-174.
-
(2005)
IEEE International Conference on Integrated Circuits Design and Technology
, pp. 171-174
-
-
Naeemi, A.1
Joshi, Y.2
Fedorov, A.3
Kohl, P.4
Meindl, J.D.5
-
8
-
-
0028728571
-
Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks. Part 2. Flow Rate and Pressure Drop Constraints
-
Bowers, M. B., and Mudawar, I., 1994, "Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks. Part 2. Flow Rate and Pressure Drop Constraints," ASME J. Electron. Packag., 116, pp. 290-305.
-
(1994)
ASME J. Electron. Packag
, vol.116
, pp. 290-305
-
-
Bowers, M.B.1
Mudawar, I.2
-
9
-
-
0033352431
-
Integrated Single and Two-Phase Micro Heat Sinks Under IGBT Chips
-
Gillot, C., Meysenc, L., Schaeffer, C., and Bricad, A., 1999, "Integrated Single and Two-Phase Micro Heat Sinks Under IGBT Chips," IEEE Trans. Compon. Packag. Technol., 22(3), pp. 384-389.
-
(1999)
IEEE Trans. Compon. Packag. Technol
, vol.22
, Issue.3
, pp. 384-389
-
-
Gillot, C.1
Meysenc, L.2
Schaeffer, C.3
Bricad, A.4
-
10
-
-
0036767898
-
Closed-Loop Electroosmotic MicroChannel Cooling System for VLSI Circuits
-
Jiang, L., Mikkelsen, J., Koo, J. M., Huber, D., Yao, S., Zhang, L., Zhou, P., Maveety, J., Prasher, R., Santiago, J., Kenny, T., and Goodson, K., 2002, "Closed-Loop Electroosmotic MicroChannel Cooling System for VLSI Circuits," IEEE Trans. Compon. Packag. Technol., 25(3), pp. 347-355.
-
(2002)
IEEE Trans. Compon. Packag. Technol
, vol.25
, Issue.3
, pp. 347-355
-
-
Jiang, L.1
Mikkelsen, J.2
Koo, J.M.3
Huber, D.4
Yao, S.5
Zhang, L.6
Zhou, P.7
Maveety, J.8
Prasher, R.9
Santiago, J.10
Kenny, T.11
Goodson, K.12
-
11
-
-
1142293842
-
Measurement and Correlation of Critical Heat Flux in Two-Phase Micro-Channel Heat Sinks
-
Qu, W., and Mudawar, I., 2003, "Measurement and Correlation of Critical Heat Flux in Two-Phase Micro-Channel Heat Sinks," Int. J. Heat Mass Transfer, 47, pp. 2045-2059.
-
(2003)
Int. J. Heat Mass Transfer
, vol.47
, pp. 2045-2059
-
-
Qu, W.1
Mudawar, I.2
-
12
-
-
0038707159
-
High Speed Photographic Observation of Flow Boiling of Water in Parallel Mini-Channels
-
ASME, Anaheim, CA, pp
-
Kandlikar, S. G., and Steinke, M. E., 2001, "High Speed Photographic Observation of Flow Boiling of Water in Parallel Mini-Channels," Proceedings of the 35th National Heat Transfer Conference, ASME, Anaheim, CA, pp. 675-684.
-
(2001)
Proceedings of the 35th National Heat Transfer Conference
, pp. 675-684
-
-
Kandlikar, S.G.1
Steinke, M.E.2
-
13
-
-
0037908794
-
Visualization and Measurements of Periodic Boiling in Silicon Microchannels
-
Wu, H. Y., and Cheng, P., 2003, "Visualization and Measurements of Periodic Boiling in Silicon Microchannels," Int. J. Heat Mass Transfer, 46, pp. 2603-2614.
-
(2003)
Int. J. Heat Mass Transfer
, vol.46
, pp. 2603-2614
-
-
Wu, H.Y.1
Cheng, P.2
-
15
-
-
0036767710
-
Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics
-
Phelan, P. E., Chiriac, V. A., and Lee, T.-Y. T., 2002, "Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics," IEEE Trans. Compon. Packag. Technol., 25(3), pp. 356-365.
-
(2002)
IEEE Trans. Compon. Packag. Technol
, vol.25
, Issue.3
, pp. 356-365
-
-
Phelan, P.E.1
Chiriac, V.A.2
Lee, T.-Y.T.3
-
16
-
-
4444284919
-
Designing a Mesoscale Vapor-Compression Refrigerator for Cooling High Power Microelectronics
-
Las Vegas, NV, IEEE, pp
-
Phelan, P. E., Swanson, J., Chiriac, F., and Chiriac, V., 2004, "Designing a Mesoscale Vapor-Compression Refrigerator for Cooling High Power Microelectronics," Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM04, Las Vegas, NV, IEEE, pp. 218-223.
-
(2004)
Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM04
, pp. 218-223
-
-
Phelan, P.E.1
Swanson, J.2
Chiriac, F.3
Chiriac, V.4
-
17
-
-
84950153018
-
Miniature Vapor Compression Refrigeration Systems for Active Cooling of High Performance Computers
-
Heydari, A., 2002, "Miniature Vapor Compression Refrigeration Systems for Active Cooling of High Performance Computers," 2002, Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM02, San Diego, CA, IEEE, pp. 371-378.
-
(2002)
Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM02, San Diego, CA, IEEE
-
-
Heydari, A.1
|