Numerical analysis of the energy contributions in peel tests: A steady-state multilevel finite element approach

International Journal of Adhesion and Adhesives

Volumn 28, Issue 4-5, 2008, Pages 222-236

  Martiny, Ph ^a   Lani, F ^a   Kinloch, A J ^b   Pardoen, T ^c  

^a CENAERO   (Belgium)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

^c UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

Author keywords

Adhesive fracture energy; Finite element stress analysis; Fracture mechanics

Indexed keywords

COMPUTER SIMULATION; CONTINUUM DAMAGE MECHANICS; ELASTOPLASTICITY; FINITE ELEMENT METHOD; FRACTURE ENERGY; PEELING; STRAIN ENERGY;

ADHESIVE FRACTURE ENERGY; PLASTIC DISSIPATION; STEADY STATE MULTILEVEL FINITE ELEMENT METHODS; WEDGE PEEL TEST;

ADHESIVE JOINTS;

EID: 38549124579     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2007.06.005     Document Type: Article

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