The impact of diamond conditioning on surface contact in CMP pads

Materials Research Society Symposium Proceedings

Volumn 991, Issue , 2007, Pages 15-20

  Elmufdi, Carolina L ^a   Muldowney, Gregory P ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONFOCAL MICROSCOPY; MICROSTRUCTURE; SURFACE MORPHOLOGY; WAFER BONDING;

CONTACT AREA; DEFECTIVITY; PAD MICROSTRUCTURE; SOFT POROUS POLYURETHANE PADS;

DIAMOND CUTTING TOOLS;

EID: 38549104976     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0991-c01-02     Document Type: Conference Paper

References (8)

1. G. P. Muldowney, Proceedings of CMP-MIC Conference (2007).
2. G. P. Muldowney, presented at MRS Spring Meeting (2007).
3. C. L. Markham, CMP-MIC Conference Panel Presentation (2006).
4. G. P. Muldowney, C. H. Duong, M. R. VanHanehem, and C. C. Kuo, Proceedings of ISTC Conference (2007).
5. A.S. Lawing, Semicon China 2004, SEMI Technology Symposium (2004).
6. A.S. Lawing, Proceedings of CMP-MIC Conference (2005).
7. C. L. Elmufdi and G. P. Muldowney, Mater. Res. Soc. Symp. Proc. 914 (2006).
8. B. Jiang and G. P. Muldowney, presented at MRS Spring Meeting (2007).