Photoresist characterization and wet strip after low-k dry etch

Solid State Phenomena

Volumn 134, Issue , 2008, Pages 325-328

  Claes, M ^a   Le, Q T ^a   Keldermans, J ^b   Kesters, E ^a   Lux, M ^a   Franquet, A ^a   Vereecke, G ^a   Mertens, P W ^a   Frank, M M ^c   Carleer, R ^d   Adriaensens, P ^d   Vanderzande, D ^d  

^a IMEC   (Belgium)

^b Leuven Hogeschool   (Belgium)

^c IBM T J WATSON RESEARCH CENTER   (United States)

^d HASSELT UNIVERSITY   (Belgium)

Author keywords

BEOL; Low k; Megasonic; Polymer characterization; Post etch photoresist; Solvents

Indexed keywords

EID: 38549095190     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.134.325     Document Type: Conference Paper

References (3)

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2. I. Tohno et al., Jpn. J. Appl. Phys., 40 (2001) p. 798.
3. C. M. Hansen, Hansen Solubility Parameters: A Users Handbook (CRC Press LLC, 2000).