Automated, high precision measurement of critical dimensions using the atomic force microscope

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 4, 1999, Pages 1457-1462

  Chernoff, Donald A ^a   Burkhead, David L ^a  

^a Advanced Surface Microscopy   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 3843107080     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581836     Document Type: Article

References (12)

1. W. A. Levinson, Semicond. Int. 18(10), 165 (Oct. 1995); 19(2), 113 (Feb. 1996).
2. W. A. Levinson, Semicond. Int. 18(10), 165 (Oct. 1995); 19(2), 113 (Feb. 1996).
3. D. Hansen, M. Lines, D. Chernoff, and J. Lohr, Proc. SPIE 3050, 361 (1997); ASM sells these calibration specimens.
4. O. Beom-h., W. Y. Song, B. C. Park, and Y. U. Ko, Proc. SPIE 3677, (1999).
5. D. A. Chernoff and J. D. Lohr, U.S. Patents Nos. 5,644,512 and 5,825,670.
6. D. A. Chernoff, J. D. Lohr, D. Hansen, and M. Lines, Proc. SPIE 3050, 243 (1997).
7. D. A. Chernoff and D. L. Burkhead, Proc. SPIE 3677, (1999).
8. The width is the full width at half height measured across the bump. The length is the analogous quantity measured along the bump.
9. The edges are transitions from bump to land and land to bump. During playback these are registered as logical 1. The absence of a transition is logical 0.
10. K. C. Pohlmann, The Compact Disc Handbook, 2nd ed. (A-R Editions, Madison, WI, 1992), p. 87.
11. The land length is the distance between the rear edge (at half height) of one bump and the front edge of the next bump.
12. G. J. Verhaart, Replitech International June, 1997, Speaker Presentations, p. 383.