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Volumn 534-536, Issue , 2007, Pages 1505-1508
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Structural and thermal properties of hot pressed Cu/C matrix composites materials used for the thermal management of high power electronic devices
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Author keywords
Copper carbon composites; CTE; Hot pressing; Thermal management
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Indexed keywords
CARBON FIBERS;
COPPER POWDER;
ELECTRIC POWER SYSTEMS;
GLASS CERAMICS;
HOT PRESSING;
METALLIC MATRIX COMPOSITES;
POWDER METALLURGY;
REINFORCED PLASTICS;
REINFORCEMENT;
TEMPERATURE CONTROL;
THERMAL EXPANSION;
VOLUME FRACTION;
CARBON REINFORCEMENTS;
CONDUCTIVITY PROPERTIES;
COPPER MATRIX COMPOSITE;
ELECTRONIC APPLICATION;
FIBER/MATRIX INTERACTIONS;
HIGH-POWER ELECTRONIC DEVICES;
LOW COEFFICIENT OF THERMAL EXPANSIONS;
SHORT CARBON FIBERS;
THERMAL CONDUCTIVITY;
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EID: 38349192761
PISSN: 02555476
EISSN: 16629752
Source Type: Book Series
DOI: 10.4028/www.scientific.net/MSF.534-536.1505 Document Type: Conference Paper |
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Times cited : (16)
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References (6)
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