Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging

Sensors and Actuators, A: Physical

Volumn 141, Issue 2, 2008, Pages 685-694

  Dixit, Pradeep ^a   Lin, Nay ^a   Miao, Jianmin ^a   Wong, Wai Kwan ^b   Choon, Teo Kiat ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b DELPHI AUTOMOTIVE SYSTEMS SINGAPORE PTE LTD   (Singapore)

Author keywords

Deep reactive ion etching; Electronic packaging; Heat dissipation; MEMS; Micromasking effect; Silicon pillars

Indexed keywords

ETCHING; HEAT LOSSES; HEAT SINKS; MEMS; MICROCHANNELS; MULTILAYERS;

ELECTRONIC PACKAGING; MICROMASKING EFFECT;

SILICON;

EID: 38349081248     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.09.006     Document Type: Article

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