Interaction between Cu and Sn in the early stages of ageing of Al-1.7at.%Cu-0.01at.%Sn

Materials Science Forum

Volumn 519-521, Issue PART 1, 2006, Pages 495-500

  Bourgeois, L ^a   Wong, T ^a   Xiong, X Y ^a   Nie, J F ^a   Muddle, B C ^a  

^a MONASH UNIVERSITY   (Australia)

Author keywords

3D atom probe; Al Cu; Microalloying; Natural ageing; Transmission electron microscopy

Indexed keywords

AGE HARDENING; DENSITY (SPECIFIC GRAVITY); GRAIN REFINEMENT; HARDNESS; TRANSMISSION ELECTRON MICROSCOPY;

ARTIFICIAL AGEING TEMPERATURE; NATURAL AGEING; VACANCIES INETRACTIONS;

MICROALLOYING;

EID: 37849016246     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-408-1.495     Document Type: Conference Paper

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