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Volumn 105, Issue 10, 2007, Pages 260-271
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Tin, lead, and tin-lead plating
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRODES;
ELECTROPLATING;
LEAD ALLOYS;
POROSITY;
SOLDERING;
TINNING;
ELECTRONICS COMPONENTS;
PLATE TRANSISTORS;
LEAD PLATING;
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EID: 37649013620
PISSN: 00260576
EISSN: None
Source Type: Journal
DOI: 10.1016/S0026-0576(07)80344-8 Document Type: Note |
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Times cited : (2)
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References (0)
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