Formation and growth of intermetallic compound at interface of steel/aluminum bonding sheet

Tetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan

Volumn 83, Issue 10, 1997, Pages 37-42

  Oikawa, Hatsuhiko ^a   Saitoh, Tohru ^a,b   Nagase, Takao ^a   Kiriyama, Tadao ^a  

^a NIPPON STEEL CORPORATION   (Japan)

^b Yutaka Electric Manufacturing Corp

Author keywords

Aluminum sheet; Bonding; Bonding strength; Cold rolled steel sheet; Diffusion; Heat treatment; Interface; Intermetallic compound; Stainless steel sheet

Indexed keywords

EID: 3743155480     PISSN: 00211575     EISSN: None     Source Type: Journal    
DOI: 10.2355/tetsutohagane1955.83.10_641     Document Type: Article

References (10)