The application of flip-chip bonding interconnection technique on the module assembly of 10 Gbps laser diode

Journal of Electronic Materials

Volumn 27, Issue 8, 1998, Pages 985-989

  Han, Haksoo ^a   Chung, Hyunsoo ^a   Joe, Yung Il ^a   Park, Seongsu ^b   Joo, Gwangchong ^b   Hwang, Nam ^b   Song, Minkyu ^b  

^a Yonsei University   (South Korea)

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

Bandwidth; Flip chip bonding; Laser diode; Solder bumps

Indexed keywords

EID: 3743116086     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0131-2     Document Type: Article

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