Epitaxial film bonding technology for integrating dissimilar device materials

International Conference on Digital Printing Technologies

Volumn , Issue , 2007, Pages 912-916

  Lgari, Tomoki ^a   Fujiwara, Hinyuki ^a   Suzuki, Takahito ^a   Sagimori, Tomohiko ^a   Furuta, Hironori ^a   Nakai, Yusuke ^a   Ogihara, Mitsuhiko ^a  

^a Oki Digital Imaging Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; GALLIUM COMPOUNDS; INTEGRATED CIRCUITS; LIGHT EMITTING DIODES; SUBSTRATES;

DEVICE MATERIALS; DEVICE STRUCTURE; DIGITAL FABRICATION;

EPITAXIAL FILMS;

EID: 37349071686     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

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2. M. Ogihara, H. Fujiwara, M. Mutoh, T. Suzuki, T. Sagimori, H. Kurokawa, T. Igari, T. Kaneto, H. Furuta, I. Abiko, and M. Sakuta, "New printhead using LED arrays integrated with IC drivers", Proc. 22nd Int. Conf. on Digital Printing Technologies, pp.402-405, Denver, Colorado, Sept. 17-22, 2006.
3. for example, D. L. Mathine, 'The integration of III-V optoelectronics with silicon circuitry', IEEE J. Select. Topics Quantum Electron., 1997, vol. 3, (3), pp. 952-959
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5. E. Yablonovitch, T. Gmitter, J. P. Harbison, and R. Bhat, 'Extreme selectivity in the lift-off of epitaxial GaAs films', Appl. Phys. Lett., 1987, 51, (26), pp. 2222-2224