Inkjet patterning of UV curable etching resist for flexible conductive circuit electrodes

International Conference on Digital Printing Technologies

Volumn , Issue , 2007, Pages 855-858

  Wang, Chung Wei ^a   Chen, Wen Chun ^a   Cheng, Kevin ^a   Lee, Yuh Zheng ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILMS; ELECTRODES; INK; SURFACE TENSION; VISCOSITY;

CIRCUIT ELECTRODES; FLEXIBLE SUBSTRATES; INKJET PRINTING; STRIPING PROCESS;

ETCHING;

EID: 37349018966     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Mark James, "Photochemical Machining by Ink Jet A Revolution in the Making." IST's NIP20: International Conference on Digital Printing Technologies, PP. 279-283, 2004
2. Kevin Cheng, Ming-Huan Yang, Wanda W. W. Chiu, Chieh-Yi Huang, Ja ne Chang, & Tai-Fa Yin, "Ink-jet printing, self-assembled polyelectrolytes, and electroless plating: Low cost fabrication of circuits on flexible substrates at room temperature." MRC Vol. 26, PP. 247-264, 2005
3. D. Redinger, R. Farshchi, and V. Subramanian, "Inkjetted Passive Components on Plastic Substrate for RFID", to be presented, IEEE Device Research Conference.,2003
4. R. W. Stowe, R. W. "PRACTICAL Relationships Between UV Lamps and the UV Curing Process Window," Proceedings, RadTech North America; 1994
5. R. W. Stowe, "Effect of UV Exposure Conditions on Speed, Depth Cure and Adhesion," Proceedings, RadTech North America; 2002
6. R. W. Stowe, "Key Factor of UV Curing of Ink Jet Printing " IST's NIP19: International Conference on Digital Printing Technologies, PP.186-189, 2003