Analysis of Coulomb and Johnsen-Rahbek electrostatic chuck performance for extreme ultraviolet lithography

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 25, Issue 6, 2007, Pages 2155-2161

  Sogard, M R ^a   Mikkelson, A R ^b   Nataraju, M ^b   Turner, K T ^b   Engelstad, R L ^b  

^a Nikon Res Corporation of America   (United States)

^b Wisconsin Electric Machines and Power Electronics Consortium   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COULOMB ELECTROSTATIC CHUCK; ELECTROSTATIC CHUCKING; JOHNSEN-RAHBEK CHUCK;

COMPUTER SIMULATION; COULOMB INTERACTIONS; EXTREME ULTRAVIOLET LITHOGRAPHY; FINITE ELEMENT METHOD; GEOMETRY; SCANNING ELECTRON MICROSCOPY;

ELECTROSTATIC DEVICES;

EID: 37149014490     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2798724     Document Type: Article

References (7)

1. SEMI P37-1102, SEMI Standard Specification for Extreme Ultraviolet Lithography Mask Substrates.
2. SEMI P40-1103, SEMI Standard Specification for Mounting Requirements and Alignment Reference Locations for Extreme Ultraviolet Lithography Masks.
3. L. D. Hartsough, Solid State Technol. 35, 87 (1993).
4. D. Wright, L. Chen, P. Federlin, and K. Forbes, J. Vac. Sci. Technol. B 1071-1023 10.1116/1.588108 13, 1910 (1995).
5. T. Watanabe, T. Kitabayashi, and C. Nakayama, Jpn. J. Appl. Phys., Part 1 0021-4922 10.1143/JJAP.32.864 32, 864 (1993).
6. B. Levchenko, arXiv:cond-mat/0512513.
7. H. B. Chan, V. A. Aksyuk, R. N. Kleiman, D. J. Bishop, and F. Capasso, Science 0036-8075 10.1126/science.1057984 291, 1941 (2001).