A mechanical, electrical, thermal coupled-field simulation of a sphere-plane electrical contact

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 4, 2007, Pages 787-795

  Monnier, Arnaud ^a,b   Froidurot, B ^b   Jarrige, C ^b   Teste P ^a   Meyer, R ^a  

^a UNIV PARIS SUD   (France)

^b SCHNEIDER ELECTRIC   (France)

Author keywords

Ag; Copper; Electric conductivity; Electrical contact; Oxygen; Oxygen free high conductivity (OFHC) Cu; Simulation; Sphere plane

Indexed keywords

ELECTRICAL SIMULATION; MECHANICAL SIMULATION; OXYGEN FREE HIGH CONDUCTIVITY; SPHERE-PLANE; THERMAL SIMULATION;

COMPUTER SIMULATION; DEFORMATION; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; TEMPERATURE DISTRIBUTION;

ELECTRIC CONTACTS;

EID: 37049027560     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.906288     Document Type: Article

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