Topology optimization for thermal problems based on assumed continuous approximation of material distributions

Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C

Volumn 73, Issue 9, 2007, Pages 2426-2433

  Iga, Atsuro ^a   Nishiwaki, Shinji ^b   Izui, Kazuhiro ^b   Yoshimura, Masataka ^b  

^a KYOTO UNIVERSITY   (Japan)

^b NONE

Author keywords

Finite element method; Heat conduction; Optimum design; Sensitivity analysis; Structural analysis

Indexed keywords

FINITE ELEMENT METHOD; HEAT CONDUCTION; SENSITIVITY ANALYSIS; SHAPE OPTIMIZATION; STRUCTURAL ANALYSIS; THERMAL DIFFUSION;

HEAT CONVECTION BOUNDARIES; HEAT TRANSFER BOUNDARIES; SEQUENTIAL LINEAR PROGRAMMING (SLP); TEMPERATURE DIFFUSIVITY;

MATERIALS SCIENCE;

EID: 37049013932     PISSN: 03875024     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaic.73.2426     Document Type: Article

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