Probing elastic modulus and depth of bottom-supported inclusions in model tissues using piezoelectric cantilevers

Review of Scientific Instruments

Volumn 78, Issue 11, 2007, Pages

  Yegingil, Hakki ^a   Shih, Wan Y ^b   Shih, Wei Heng ^a  

^a Drexel University   (United States)

^b DREXEL UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CANTILEVER BEAMS; ELASTIC MODULI; INCLUSIONS; SENSITIVITY ANALYSIS; TUMORS;

CLAY INCLUSIONS; GELATIN MATRIX; PIEZOELECTRIC CANTILEVER SENSORS; PIEZOELECTRIC CANTILEVERS;

PIEZOELECTRIC MATERIALS;

ARTICLE; COMPUTER AIDED DESIGN; CONNECTIVE TISSUE; ELASTICITY; ELECTROCHEMISTRY; EQUIPMENT; EQUIPMENT DESIGN; EVALUATION; HARDNESS; INSTRUMENTATION; MECHANICAL STRESS; METHODOLOGY; PHYSIOLOGY; REPRODUCIBILITY; SENSITIVITY AND SPECIFICITY; STIMULATION; TRANSDUCER;

COMPUTER-AIDED DESIGN; CONNECTIVE TISSUE; ELASTICITY; ELECTROCHEMISTRY; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; HARDNESS; HARDNESS TESTS; PHYSICAL STIMULATION; REPRODUCIBILITY OF RESULTS; SENSITIVITY AND SPECIFICITY; STRESS, MECHANICAL; TRANSDUCERS;

EID: 36749046931     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2793502     Document Type: Article

References (23)

1. J. F. Greenleaf, M. Fatemi, and M. Insana, Annu. Rev. Biophys. Biophys. Chem. 5, 57 (2003).
2. A. P. Sarvazyan, J. Acoust. Soc. Am. 93, 2329 (1993).
3. P. S. Wellman, R. D. Howe, E. Dalton, and K. A. Kern, http://biorobotics.harvard.edu/pubs/mechprops.pdf
4. G. W. Schmid-Schonbein, K.-L. Paul, H. Tozeren, R. Skalak, and S. Chien, Biophys. J. 36, 243 (1981).
5. P. Wakely, W. J. Frable, and J. S. Kneisl, Cancer Cytopathology 93, 35 (2001).
6. Y. Murayama and S. Omata, Sens. Actuators, A 109, 202 (2004).
7. Y. Murayama, C. E. Constantinou, and S. Omata, Sens. Actuators, A 120, 543 (2005).
8. A. Samani, J. Bishop, C. Luginbuhl, and D. B. Plewes, Phys. Med. Biol. 48, 2183 (2003).
9. J. W. Klaesner, P. K. Commean, M. K. Hastings, D. Zu, and M. J. Mueller, IEEE Trans. Neural Syst. Rehabil. Eng. 9, 232 (2001).
10. J. W. Klaesner, M. K. Hastings, D. Zou, C. Lewis, and M. J. Mueller, Arch. Phys. Med. Rehabil. 83, 1796 (2002).
11. K. Rome and P. Webb, Clin. Biomech. (Bristol, Avon) 15, 298 (2000).
12. Y. Huang, Y. Zheng, and S. Leung, Clin. Biomech. (Bristol, Avon) 20, 145 (2005).
13. L. Han, J. A. Noble, and M. Burcher, Ultrasound Med. Biol. 29, 813 (2003).
14. Y. Zheng and A. F. T. Mak, IEEE Trans. Rehabil. Eng. 7, 257 (1999).
15. A. Manduca, T. E. Oliphant, M. A. Dresner, J. L. Mahowald, S. A. Kruse, E. Amromin, J. P. Felmlee, J. F. Greenleaf, and R. L. Ehman, Med. Image Anal 5, 237 (2001).
16. J. Ophir, I. Cespedes, H. Ponnekanti, Y. Yazdi, and X. Li, Ultrason. Imaging 13, 111 (1991).
17. D. B. Plewes, J. Bishop, A. Samani, and J. Sciarretta, Phys. Med. Biol. 45, 1591 (2000).
18. R. Sinkus, J. Lorenzen, D. Schrader, M. Lorenzen, M. Dargatz, and D. Holz, Phys. Med. Biol. 45, 1649 (2000).
19. A. Markidou, W. Y. Shih, and W.-H. Shih, Rev. Sci. Instrum. 76, 064302 (2005).
20. H. O. Yegingil, W. Y. Shih, W. Anjum, A. D. Brooks, and W.-H. Shih, Mater. Res. Soc. Symp. Proc., 898E, L01 (2006).
21. S. T. Szewczyk, W. Y. Shih, and W.-H. Shih, Rev. Sci. Instrum. 77, 044302 (2006).
22. H. O. Yegingil, W. Y. Shih, and W.-H. Shih, J. Appl. Phys. 101, 054510 (2007).
23. G. M. Pharr, W. C. Oliver, and F. R. Brotzen, J. Mater. Res. 7, 613 (1992).