Research on the performance of the phase change material wallboard room

Taiyangneng Xuebao/Acta Energiae Solaris Sinica

Volumn 28, Issue 10, 2007, Pages 1085-1090

  He, Yecong ^a   Zhou, Jie ^a   Wang, Houhua ^a   Tan, Min ^b  

^a CHONGQING UNIVERSITY   (China)

^b HUNAN URBAN CONSTRUCTION COLLEGE   (China)

Author keywords

Building energy conservation; Enthalpy model; Load shifting; Phase change material (PCM) wallboard

Indexed keywords

BUILDINGS; ECONOMIC ANALYSIS; ENERGY CONSERVATION; PHASE CHANGE MATERIALS; THERMAL COMFORT;

BUILDING ENERGY CONSERVATION; ENTHALPY MODEL; HEAT TRANSFER PERFORMANCE; LOAD SHIFTING; PHASE CHANGE MATERIAL (PCM) WALLBOARD; SUMMER; WINTER;

HEAT TRANSFER;

EID: 36549065802     PISSN: 02540096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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4. Shamsundar N, Sparrow E M. Analysis of multidimensional conduction phase change via the enthalpy model[J]. Journal of Heat Transfer, 1975, 8: 333-340.
5. Zhang Yinping, Ding Jianhong, et al. Influence of additives on the thermal conductivity of shape-stabilized phase change material[J]. Solar Energy Materials and Solar Cells, 2006, (90): 1692-1702.