In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnects

Journal of Applied Physics

Volumn 78, Issue 7, 1995, Pages 4428-4437

  Lee, K L ^a   Hu, C K ^a   Tu, K N ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 36449008541     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.359851     Document Type: Article

References (24)

1. Deposition and growth: Limits for Microelectronics