Fracture of metal-polymer line structures. I. Semiflexible polyimide

Journal of Applied Physics

Volumn 76, Issue 9, 1994, Pages 5136-5142

  Chiu, S L ^a   Leu, J ^b   Ho, P S ^b  

^a IBM MICROELECTRONICS   (United States)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 36448999689     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.357227     Document Type: Article

References (10)