Multi-material compliant mechanism design and haptic evaluation

Virtual and Physical Prototyping

Volumn 2, Issue 3, 2007, Pages 155-160

  Tang, L B ^a   Chen, Y H ^a   He, X J ^a  

^a UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Compliant mechanism; Haptic evaluation; Product design

Indexed keywords

EID: 36448961656     PISSN: 17452759     EISSN: 17452767     Source Type: Journal    
DOI: 10.1080/17452750701691831     Document Type: Article

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