Effects of Al 2O 3 films on the reliability of Au/Al joint

Nippon Steel Technical Report

Volumn , Issue 72, 1997, Pages 95-101

  Tsuge, Atsuko ^a   Uno, Tomohiro ^a   Mizuno, Kaoru ^a   Tatsumi, Kohei ^a  

^a Technical Development Bureau   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA FILMS; GOLD ALUMINUM JOINT; VOIDS; ELECTRICAL CONNECTION; ISLAND FORMATION; JOINT INTERFACES;

ALUMINA; ATOMS; AUGER ELECTRON SPECTROSCOPY; DIFFUSION; ELECTRIC RESISTANCE MEASUREMENT; GOLD; INTERMETALLICS; RELIABILITY; SECONDARY ION MASS SPECTROMETRY; THERMAL EFFECTS; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY; ELECTRIC RESISTANCE; JOINTS (STRUCTURAL COMPONENTS);

SOLDERED JOINTS; ALUMINA;

EID: 3643097307     PISSN: 0300306X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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