Direct patterning of spin-on-glass materials by ArF excimer laser irradiation and their new application to hard-mask processes

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 35, Issue 12 SUPPL. B, 1996, Pages 6366-6369

  Morisawa, Taku ^a   Fukuda, Hiroshi ^a  

^a HITACHI LTD   (Japan)

Author keywords

ArF excimer laser; Hard mask; Lithography; Photo oxidation; Resist; Silazane; Silsesqoxane; Spin on glass (SOG)

Indexed keywords

EID: 3643083394     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.35.6366     Document Type: Article

References (13)

1. G. M. Wallraff, R. D. Allen, W. D. Hinsberg, C. F. Larson, R. D. Ohnson, R. DiPietro, G. Breyta, N. Hacker and R. R. Kunz: J. Vac. Sci. Technol. B 11 (1993) 2783.
2. Y. Kaimoto, K. Nozaki, S. Takechi and N. Abe: Proc. SPIE 1672 (1992) 66.
3. M. Nakase, T. Naito, K. Asakawa, A. Hongu, N. Shida and T. Ushirogouchi: Proc. SPIE 2438 (1995) 445.
4. For example; T. Kikkawa, K. Kikuta, K. Tsunenari, K. Ohto, H. Aoki, J. M. Drynan, N. Kasai and T. Kunio: Jpn. J. Appl. Phys. 32 (1993) 338.
5. K. Watanabe, M. Igarashi, E. Yano, T. Namiki, K. Nozaki and Y. Kuramitu: J. Photopolym. Sci. & Technol. 8 (1995) 11.
6. T. Ito, M. Sakata, A. Endo, H. Jinbo and I. Ashida: Jpn. J. Appl. Phys. 32 (1993) 6052.
7. R. R. Kunz, M. W. Horn, P. A. Biancom, D. A. Smith and J. R. Eshelman: J. Vac. Sci. Technol. B 10 (1992) 2554.
8. T. W. Weideman, O. Joubert, A. M. Joshi and R. I. Kostelak: Proc. SPIE 2438 (1995) 496.
9. T. Morisawa and H. Fukuda: 1st Int. Symp. ArF Excimer Laser Lithography: Aug. 1995, Colorado Springs.
10. H. Sugiyama, T. Inoue, A. Mizushima and K. Nate: Proc. SPIE 920 (1988) 268.
11. T. Nagashima and H. Harada: VLSI Maltilevel Interconnection Conf. Proc. (1993) p. 217.
12. N. Hayashi, T. Ueno, H. Shiraishi, T. Nishida, M. Toriumi and S. Nonogaki: ACS Symp. Series 346 (1987) 211.
13. N. Ohashi, H. Nezu, H. Murayama, T. Fujiwara, H. Aoki, H. Yamaguchi and N. Owada: Dielectrics for VLSI/ULSI Multilevel Interconnection Conf. Proc. (1996) p. 86.