Fabrication of precise die edges for micro-optical and MEMS applications

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 4, 2007, Pages 725-730

  Kommera, Swaroop ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

Deep silicon etch; Dies (machine tools); Etching; LCoS displays; Micro displays; Precise die edges; Silicon; Tiling

Indexed keywords

DEPOSITION; DIES; ETCHING; MEMS; MICROOPTICS; PROTECTIVE COATINGS; SEMICONDUCTING SILICON;

DEEP SILICON ETCH; PRECISE DIE EDGES; SILICON DIE;

FABRICATION;

EID: 36348964325     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.908025     Document Type: Article

References (9)

1. J. P. Krusius, "Method for assembling a tiled, flat-panel display," U.S. Patent 6 476 886, 2002.
2. J. P. Krusius, "Method for assembling a tiled, flat-panel microdisplay array having reflective microdisplay tiles and attaching thermally-conductive substrates," U.S. Patent 6 556 261, 2003.
3. J. P. Krusius, "Method for assembling a tiled, flat-panel microdisplay array having imperceptible seams," U.S. Patent 6 567 138, 2003,.
4. A. T. Cheung, "Dicing Advanced Materials for Microelectronics," in Proc. Int. Symp. Exhibit. Adv. Packag.Materials Processes,Mar. 2005, pp. 149-152.
5. U. Efrat, "Optimizing theWafer Dicing Process," in IEEE/CHMT Eur. Int. Electronic Manufactur. Technol. Symp., 1993, pp. 245-253.
6. P. McCabe, "Sawing Silicon," Advanced Packaging vol. 14, no. 3, Mar. 2005, pp. 26-27.
7. M. Li et al., "Study of silicon micromachining using diode-pumped solid-state lasers," Proc. SPIE, vol. 5339, pp. 64-72.
8. Technical data sheet A-174 Speciality Coating Systems, Indianapolis, IN.
9. B. Ilic et al., "Fabrication of Flexible Polymer Tubes for Micro and Nanofluidic Applications," J. Vacuum Sci. Technol. B, vol. 20, no. 6, pp. 2459-2465, 2002.