Utility of nonwovens in the production of integrated electrical circuits via printing conductive inks

Journal of the Textile Institute

Volumn 99, Issue 1, 2008, Pages 37-45

  Karaguzel, B ^a   Merritt, C R ^a   Kang, T ^a   Wilson, J M ^a   Nagle, H T ^a   Grant, E ^a   Pourdeyhimi, B ^a  

^a NORTH CAROLINA STATE UNIVERSITY   (United States)

Author keywords

Conductive inks; Electrical circuits; Nonwovens; Printing

Indexed keywords

CONTACT ANGLE; INK; INTEGRATED CIRCUITS; TEXTILE PRINTING; VISCOSITY;

CONDUCTIVE INK; POLYMER THICK FILM PROCESS;

NONWOVEN FABRICS;

ELECTRICAL CONDUCTIVITY; FILM; NONWOVEN FABRIC; POLYMER; PRINTING; PRINTING INK; SUBSTRATE; VISCOSITY;

EID: 36348936768     PISSN: 00405000     EISSN: 17542340     Source Type: Journal    
DOI: 10.1080/00405000701547748     Document Type: Article

References (19)

1. Axisa, F., Schmitt, P. M., Gehin, C., Delhomme, G., McAdams, E. and Dittmar, A. (2005) Flexible technologies and smart clothing for citizen medicine, home healthcare, and disease prevention. IEEE Trans. Inf. Technol. Biomed., 9:3, pp. 325-336.
2. Bolger, J. C., Astle, R. J. and Morano, S. L. (1980) Conductive adhesives, inks and coatings. Adhesives for Industry Conference El Segundo, CApp. 71-91.
3. Carpi, F. and De Rossi, D. (2005) Electroactive polymer-based devices for e-textiles in biomedicina. IEEE Trans. Inf. Technol. Biomed., 9:3, pp. 295-318.
4. Ethridge, E. (2002) ElectroTextiles-Technology to applications. Mater. Res. Soc. Symp. Proc., 736, pp. 3-12.
5. Gimpe, S., MöHring, U., Müller, H., Neudeck, A. and Scheibner, W. (2004) Textile-based electronic substrate technology. J. Ind. Text., 33:3, pp. 179-189.
6. Keeler, R. (1985) Polymer thick films connect for low cost conductive applications. Electron. Packag. Prod., 25:4, pp. 96-101.
7. Kim, H. S. and Pourdeyhimi, B. (2003) In-plane liquid distribution in nonwoven fabrics. Part II: Simulation. Int. Nonwovens J., 12
8. Kirstein, T., Cottet, D., Grzyb, J. and Tröster, G. (2002) Textiles for signal transmission in wearables, MAMSET 2002. Proceedings of Workshop on Modeling, Analysis, and Middleware Support for Electronic Textiles San Jose, CApp. 9-14.
9. Konopka, A., Kim, H. S. and Pourdeyhimi, B. (2002) In-plane liquid distribution of nonwoven fabrics. Int. Nonwovens J., 11:4
10. Marmur, A. and Cohen, R. D. (1997) Characterization of porous media by the kinetics of liquid penetration: The vertical capillaries model. J. Colloid Interface Sci., 189, p. 299.
11. Nazarenko, N. and Lazaridis, C. N. (1982) Polymer thick film conductors and dielectrics for membrane switches and flexible circuitry. Int. J. Hybrid Microelectron, 5, pp. 363-372.
12. Park, S. and Jayaraman, S. (2003) Enhancing the quality of life through wearable technology. IEEE Eng. Med. Biol. Mag., pp. 41-48.
13. Post, E. R., Orth, M., Russo, P. R. and Gershenfeld, N. (2000) E-broidery: Design and fabrication of textile-based computing. IBM Syst. J., 39:34, pp. 840-860.
14. Pudas, M., Hagberg, J. and Leppävuori, S. (2004) Printing parameters and ink components affecting ultra-fine-line gravure-offset printing for electronics applications. J. Eur. Ceram. Soc., 24, pp. 2943-2950.
15. Rane, S. B., Seth, T., Phatak, G. J., Amalnerkar, D. P. and Das, B. K. (2003) Influence of surfactants treatment on silver powder and its thick films. Mater. Lett., 57, pp. 3096-3100.
16. Tafreshi, H., Maze, B. and Pourdeyhimi, B. Simulating liquid flow through virtual glass fiber mats. Tex. Res. J
17. Tait, N. (2005) Wearable electronics, Canadian Apparel
18. Wentink, S. G. and Koch, S. D. (1981) UV Curing in Screen Printing for Printed Circuits and the Graphic Arts, Technology Marketing Publication, Norwalk, CT
19. Zhmud, B. V., Tiberg, F. and Hallstensson, K. (2000) Dynamics of capillary rise. J. Colloid Interface Sci., 228:2, p. 263.