Ferrite polymer composite for improving the electromagnetic compatibility of semiconductor packaging

Journal of Electronic Materials

Volumn 36, Issue 12, 2007, Pages 1711-1718

  Moon, Kyoung Sik ^a   Wong, C P ^a   Kim, Soo Hyung ^b   Choi, Hyung Do ^c   Han, Seung ^d   Yoon, Ho Gyu ^e   Suh, Kwang S ^e  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b SAMSUNG Electronics   (South Korea)

^c Electromagnetic Wave Institute   (South Korea)

^d Hyundai Development Company   (South Korea)

^e Korea University   (South Korea)

Author keywords

Electromagnetic absorber; Electronic package; EMC; EMI; EMS; Ferrite; GTEM; Polymer composite

Indexed keywords

ELECTROMAGNETIC ABSORBERS; ELECTRONIC PACKAGES; FERRITE-POLYMER COMPOSITES; FREQUENCY RANGE; MAGNETIC ENERGY;

COMPOSITE MATERIALS; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC WAVE ABSORPTION; MAGNETIC LEAKAGE; POLYMER BLENDS;

FERRITE;

EID: 36148987577     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0267-5     Document Type: Article

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