Building CMS pixel barrel detector modules

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 582, Issue 3, 2007, Pages 776-780

  Konig S ^a   Hormann Ch ^a,b   Horisberger, R ^a   Meier, B ^c   Rohe, T ^a   Streuli, S ^c   Weber, R ^a,c   Kastli H Chr ^a   Erdmann, W ^a  

^a PAUL SCHERRER INSTITUTE   (Switzerland)

^b PHYSIK INSTITUT DER UNIVERSITÄT ZÜRICH   (Switzerland)

^c ETH ZURICH   (Switzerland)

Author keywords

CMS; Module assembly; Pixel detector

Indexed keywords

PHOTODETECTORS; SELF ASSEMBLY;

BUMP BONDED; MODULE ASSEMBLY; PAUL SCHERRER INSTITUTE; PIXEL DETECTOR;

SILICON DETECTORS;

EID: 36049035622     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2007.07.090     Document Type: Article

References (5)

1. The CMS Collaboration, CMS Tracker, Technical Design Report LHCC 98-6, CERN, Geneva, Switzerland, 1998.
2. H.C. Kaestli, CMS Barrel Pixel Detector Overview, Nucl. Instr. and Meth. A (2007), in press, doi:10.1016/j.nima.2007.07.090.
3. Ch. Brönnimann, et al., Development of an indium bump bond process for silicon pixel detectors at PSI, these proceedings.
4. ® is a registrated trademark of DuPont for its polyimide film.
5. König S. Nucl. Instr. and Meth. A 565 (2006) 62