Experience with mass production bump bonding with outside vendors in the CMS FPIX project

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 582, Issue 3, 2007, Pages 771-775

  Merkel, Petra ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Bump bonding; CMS; Pixel; Silicon

Indexed keywords

PHOTODETECTORS; PRODUCTION CONTROL; RESEARCH AND DEVELOPMENT MANAGEMENT;

BUMP BONDING; MASS PRODUCTION;

SILICON DETECTORS;

EID: 36048962144     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2007.07.089     Document Type: Article

References (7)

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3. Barbero M., et al. Nucl. Instr. and Meth. A 517 (2004) 349
4. Sintef: 〈http://www.sintef.no〉.
5. IBM: 〈http://www.ibm.com〉.
6. IZM: 〈http://www.pb.izm.fhg.de/izm/index.html〉.
7. RTI: 〈http://www.rti.org〉.