Manufacturing microelectronics using 'Lase-and-Place'

Photonics Spectra

Volumn 41, Issue 10, 2007, Pages 70-74

  Mathews, Scott A ^a,b   Charipar, Nicholas A ^a   Metkus, Kristin ^a   Piqué, Alberto ^a  

^a NAVAL RESEARCH LABORATORY   (United States)

^b Catholic University of America ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT BOARD; LASER DIRECT-WRITE;

LASER PULSES; MANUFACTURE; NETWORKS (CIRCUITS); POLYMERS; SEMICONDUCTOR MATERIALS;

MICROELECTRONICS;

EID: 35648971165     PISSN: 07311230     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)

1. A. Holmes and S.M. Saidam (1998). Sacrificial layer process with laser-driven release for batch assembly operations. J MICROELECTROMECHANICAL SYSTEMS, Vol. 7, pp. 416-422.
2. A. Piqué et al (2007). Assembly and integration of thin bare die using laser direct-write. SPIE PROC. Vol. 6458, pp. 645802-1-645802-10.
3. C.B. Arnold, P. Serra and A. Piqué (January 2007). Laser direct-write techniques for printing of complex materials. MRS BULLETIN, Vol. 32, pp. 23-31.
4. A. Piqué, H. Kim and C.B. Arnold (2007). Laser forward transfer of electronic and power generating materials. In Laser Ablation and its Applications, C. Phipps, ed.; Springer, pp. 339-373.