Use of polyethyleneimine dendrimer as a novel graded-modulus interphase material in polymeric composites

Journal of Adhesion Science and Technology

Volumn 21, Issue 14, 2007, Pages 1375-1393

  Nguyen, Felix N ^a   Saks, Aaron M ^a   Berg, John C ^a  

^a University of Washington   (United States)

Author keywords

Adhesion; Fracture toughness; Gradedmodulus interphase; Nanoparticles; Particle filled nanocomposites; Particle toughened epoxy; Polyethyleneimine (PEi); Polystyrene particles; Stiffness (modulus)

Indexed keywords

DENDRIMERS; EPOXY RESINS; FRACTURE TOUGHNESS; FREE RADICAL POLYMERIZATION; NANOPARTICLES; POLYSTYRENES;

GRADEDMODULUS INTERPHASES; NON AQUEOUS POLAR SOLVENTS; PARTICLE LOADING; PARTICLE TOUGHENED EPOXY; POLYETHYLENEIMINE DENDRIMERS;

POLYMER MATRIX COMPOSITES;

EID: 35548979510     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856107782313610     Document Type: Article

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