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Volumn 40, Issue 2, 2004, Pages 119-134

Prediction and measurement of residual strains for a composite bonded joint

Author keywords

Bonded joints; Composite laminate; Interferometry; Moir ; Residual strains; Residual stresses; Three dimensional analysis

Indexed keywords

ADHESIVE BONDLINES; BONDED JOINTS; RESIDUAL STRAINS; THREE-DIMENSIONAL ANALYSIS;

EID: 3543048869     PISSN: 01915665     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:MOCM.0000025486.82165.6c     Document Type: Article
Times cited : (15)

References (14)
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  • 9
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    • B. S. Wang, F. P. Chiang, and S. Y. Wu, "Whole-field residual stress measurement in rail using moiré interferometry and Twyman/Green interferometry via thermal annealing," Experim. Mech., 39, No. 1, 71-76 (1999).
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    • Characterization of bundle-level residual strains in woven composites using moiré interferometry
    • 11-14 April
    • D.M. Mollenhauer and M. W. Holl, "Characterization of bundle-level residual strains in woven composites using moiré interferometry," in: 39th International SAMPE Symposium, 11-14 April (1994), pp. 2894-2904.
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    • Curing stresses in composite laminates
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.