Influence of thermal and mechanical load cycling on the microtensile bond strength of self-etching adhesives

American Journal of Dentistry

Volumn 20, Issue 4, 2007, Pages 250-254

  Abdalla, Ali I ^a,b   Zohairy, Ahmed A E L ^c   Aboushelib, Moustafa M N ^d   Feilzer, Albert J ^d  

^a Tanta University   (Egypt)

^b TANTA UNIVERSITY   (Egypt)

^c CAIRO UNIVERSITY   (Egypt)

^d UNIVERSITY OF AMSTERDAM   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADMIRA BOND; CLEARFIL SE BOND; DENTIN BONDING AGENT; HYBRID BOND; RESIN; RESIN CEMENT; UNCLASSIFIED DRUG;

ARTICLE; CHEMISTRY; CLINICAL TRIAL; CONTROLLED CLINICAL TRIAL; CONTROLLED STUDY; DENTAL BONDING; HEAT; HUMAN; METHODOLOGY; NONPARAMETRIC TEST; TENSILE STRENGTH; WEIGHT BEARING;

COMPOSITE RESINS; DENTAL BONDING; DENTIN-BONDING AGENTS; HEAT; HUMANS; RESIN CEMENTS; STATISTICS, NONPARAMETRIC; TENSILE STRENGTH; WEIGHT-BEARING;

EID: 35349005341     PISSN: 08948275     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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