Method for creating low cost 3D MEMS chemical sensors by using through wafer VIAS and wafer bonding

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1119-1126

  Wagner, Mark ^a   Jin, Zou ^a  

^a Sensorcon Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PACKAGING REQUIREMENTS; PROCESS DEVELOPMENT; THERMOCOMPRESSION;

INTEGRATED CIRCUIT MANUFACTURE; MECHANICAL TESTING; MEMS; WAFER BONDING; WSI CIRCUITS;

CHEMICAL SENSORS;

EID: 35348913677     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373936     Document Type: Conference Paper

References (6)

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6. A. Drost, G. Klink, S. Scherbaum, and M. Feil, "Simultaneous fabrication of dielectric and electrical joints by wafer bonding" SPIE-Micromachined Devices and Components IV, (1998), pp. 62-71