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Volumn 14, Issue 2, 2008, Pages 205-208
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Shrinkage ratio of PDMS and its alignment method for the wafer level process
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Author keywords
[No Author keywords available]
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Indexed keywords
ASPECT RATIO;
CURING;
MICROFABRICATION;
SHRINKAGE;
SILICON WAFERS;
RIGID SUBSTRATE;
WAFER-LEVEL PROCESSING;
POLYDIMETHYLSILOXANE;
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EID: 35148865098
PISSN: 09467076
EISSN: None
Source Type: Journal
DOI: 10.1007/s00542-007-0417-y Document Type: Article |
Times cited : (127)
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References (5)
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