Process window and interlayer aware OPC for the 32nm node

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6520, Issue PART 1, 2007, Pages

  Terry, Mark ^a   Zhang, Gary ^a   Lu, George ^a   Chang, Simon ^a   Aton, Tom ^a   Soper, Robert ^a   Mason, Mark ^a   Best, Shane ^a   Dostalik, Bill ^a   Hunsche, Stefan ^b   Li, Jiangwei ^b   Zhou, Rongchun ^b   Feng, Mu ^b   Burdorf, Jim ^b  

^a TEXAS INSTRUMENTS   (United States)

^b Brion Technologies Inc   (United States)

Author keywords

32nm node; Interlayer aware; OPC; Process window

Indexed keywords

IMAGE PROCESSING; LIGHTING; OPTICAL RESOLVING POWER; OPTICS; OPTIMIZATION; POLARIZATION;

ELECTRICAL VIABILITY; MASK TECHNOLOGIES; OPTICAL MICROLITHOGRAPHY; PROCESS WINDOWS;

LITHOGRAPHY;

ILLUMINATION; IMAGE ANALYSIS; LITHOGRAPHY; OPTICAL ACTIVITY; OPTICS; OPTIMIZATION; POLARIZATION;

EID: 35148817496     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.714442     Document Type: Conference Paper

References (3)

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3. L. Chen, Y. Cao, M. Preil, H. Liu, W. Shao, M. Feng, and J. Ye, Predictive focus exposure matrix modeling for rull-chip lithography applications, Proc. SPIE Vol. 6154, 2006