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Volumn 6517, Issue PART 1, 2007, Pages

Chemically amplified resists resolving 25 nm 1:1 line:Space features with EUV lithography

Author keywords

[No Author keywords available]

Indexed keywords

RESIST FACTORS; RESIST SYSTEMS; RESOLUTION CAPABILITY;

EID: 35148816568     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.712981     Document Type: Conference Paper
Times cited : (41)

References (15)
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  • 5
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    • (a) R. Kunz, "Photoresist outgassing: A potential Achilles heel for short wavelength optical lithography?", Proc. SPIE, 5376, pp. 1-15 (2004);
    • (2004) Proc. SPIE , vol.5376 , pp. 1-15
    • Kunz, R.1
  • 6
    • 24644517494 scopus 로고    scopus 로고
    • Comparison of Resist Outgassing at wavelengths from 193 nm to 13 nm
    • (b) W. D. Domke, K. Kragler, M. Kem, K. Lovack, O. Kirch, M. Bertolo, "Comparison of Resist Outgassing at wavelengths from 193 nm to 13 nm", Proc. SPIE, 5753. pp. 1066-75 (2005).
    • (2005) Proc. SPIE , vol.5753 , pp. 1066-1075
    • Domke, W.D.1    Kragler, K.2    Kem, M.3    Lovack, K.4    Kirch, O.5    Bertolo, M.6
  • 7
    • 33749268952 scopus 로고
    • Evaluation of a New Environmentally Stable Positive Tone Chemically Amplified Deep-UV Resist
    • (a) W. -S. Huang et al, "Evaluation of a New Environmentally Stable Positive Tone Chemically Amplified Deep-UV Resist," Proc. SPIE, 2195. 37 (1994);
    • (1994) Proc. SPIE , vol.2195 , pp. 37
    • Huang, W.-S.1
  • 8
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    • Delay time Effects between exposure and post exposure Bake in Acetal-based Photoresists
    • (b) H. Roschert et al, "Delay time Effects between exposure and post exposure Bake in Acetal-based Photoresists," Proc. SPIE, 1925. 14 (1993).
    • (1993) Proc. SPIE , vol.1925 , pp. 14
    • Roschert, H.1
  • 9
    • 0141500074 scopus 로고    scopus 로고
    • Extendability of Chemically Amplified Resists: Another Brick Wall?
    • (a) W. Hinsberg et al, "Extendability of Chemically Amplified Resists: Another Brick Wall?", Proc. SPIE, 5039. pp.1 - 14 (2003);
    • (2003) Proc. SPIE , vol.5039 , pp. 1-14
    • Hinsberg, W.1
  • 10
    • 0035463766 scopus 로고    scopus 로고
    • W. Hinsberg et al, Chemical and Physical aspects of the Post exposure baking process used for positive chemically amplified resists, IBM J. of Research and Development, v.45. no.5. DP 1-14 (2001)
    • (b) W. Hinsberg et al, "Chemical and Physical aspects of the Post exposure baking process used for positive chemically amplified resists, ", IBM J. of Research and Development, v.45. no.5. DP 1-14 (2001)
  • 11
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    • Resist Road to the 22 nm Technology Node
    • International
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  • 12
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    • Lithographic importance of acid diffusion in chemically amplified resists
    • (a) D. van Steenwinckel, J. H. Lammers, L. H. Leunissen, J. A. J. M. Kwinten, "Lithographic importance of acid diffusion in chemically amplified resists," Proc. SPIE, 5753. pp. 269-280 (2005);
    • (2005) Proc. SPIE , vol.5753 , pp. 269-280
    • van Steenwinckel, D.1    Lammers, J.H.2    Leunissen, L.H.3    Kwinten, J.A.J.M.4
  • 13
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    • Mark D. Smith, Jeffrey D. Byers, C. A. Mack, The lithographic impact of resist model parameters, Proc. SPIE, 5376. pp. 322-332 (2004).
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.