3D wafer level packaging approach towards cost effective low loss high density 3D stacking

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2006, Pages

  Pieters, Philip ^a   Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 34948835594     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359749     Document Type: Conference Paper

References (3)

1. th International Symposium on Micorelectronics and packaging, ISMP2005, Seoul, Korea, September 28-29.
2. Gonzales, M., et al., "System-Driven Approaches to 3D Integration", 10th Annual SMTA Pan Pacific Microelectronics Symposium & Exhibition, Kauai, HI, USA, January 25-27, 2005.
3. Labie, R., et al., "Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps", 2005 Electronic Components and Technology conference ECTC '05, Orlando, FL, USA, May 31 - June 3, 2005.