Control of the adhesion strength of thin metal films in multilayer structures

Russian Microelectronics

Volumn 36, Issue 5, 2007, Pages 313-320

  Taliashvili, Z I ^a   Vardosanidze, L R ^a   Jangidze, L B ^a   Tavkhelidze Jr , A N ^a  

^a TBILISI STATE UNIVERSITY   (Georgia)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); METALLIC FILMS; MICHELSON INTERFEROMETERS; MULTILAYER FILMS; TEMPERATURE MEASUREMENT; THERMAL EXPANSION;

ADHESION INTERACTION; METAL ELECTRODES; MULTILAYER STRUCTURES;

THIN FILMS;

EID: 34848903025     PISSN: 10637397     EISSN: None     Source Type: Journal    
DOI: 10.1134/S1063739707050058     Document Type: Article

References (10)

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10. Fizicheskie velichiny (Physical Quantities), Handbook, Grigoriev, I.S. and Melikhov, E.Z., Eds., Moscow: Energoatomizdat, 1991.