Wafer dependence of Johnsen-Rahbek type electrostatic chuck for semiconductor processes

Journal of Applied Physics

Volumn 102, Issue 6, 2007, Pages

  Qin, Shu ^a   McTeer, Allen ^a  

^a MICRON TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC DEVICES; ELECTROSTATIC DEVICES; ELECTROSTATIC FORCE; SEMICONDUCTOR DOPING; THICKNESS MEASUREMENT; WAFER BONDING;

BACKSIDE DIELECTRIC; DIELECTRIC THICKNESS; JOHNSEN-RAHBEK TYPE ELECTROSTATIC CHUCK; WAFER DEPENDENCE;

CHUCKS;

EID: 34848861650     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2778633     Document Type: Article

References (6)

1. D. R. Wright, L. Chen, P. Federlin, and K. Forbes, J. Vac. Sci. Technol. B 1071-1023 10.1116/1.588108 13, 1910 (1995).
2. G. S. Springer, in Advances in Heat Transfer, edited by, T. F. Irvine, and, J. P. Hartnett, (Academic, New York, 1971), Vol. 7.
3. S. C. Saxena and R. K. Joshi, in Thermal Accommodation and Adsorption Coefficients of Gases, McGraw-Hill/CINDAS Data Series on Material Properties Vol. II-1, edited by, Y. S. Touloukian, and, C. Y. Ho, (McGraw-Hill, New York, 1981).
4. F. A. Johnsen and K. Rahbek, J. Inst. Electr. Eng. 61, 713 (1923).
5. T. Watanabe, T. Kitabayashi, and C. Nakayama, Jpn. J. Appl. Phys., Part 1 0021-4922 10.1143/JJAP.31.2145 31, 2145 (1992).
6. S. Qin and P. Kellerman, US Patent, No. 7,072,166 (4 July 2006).