Modeling of residual thermal stresses for aluminum nitride crystal growth by sublimation

Journal of Applied Physics

Volumn 102, Issue 6, 2007, Pages

  Lee, R G ^a   Idesman, A ^a   Nyakiti, L ^a   Chaudhuri, J ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; NUMERICAL METHODS; STRESS ANALYSIS; SUBLIMATION; TEMPERATURE DISTRIBUTION; THERMAL STRESS;

ALUMINUM NITRIDE; CRUCIBLE MATERIALS; DIMENSIONLESS COORDINATES; NONSTATIONARY TEMPERATURE FIELDS;

CRYSTAL GROWTH;

EID: 34848835114     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2778741     Document Type: Article

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