Reliability of Cu interconnects with Ta implant

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 22-24

  Gambino, J ^a   Sullivan, T D ^a   Chen, F ^a   Gill, J ^a   Mongeon, S ^a   Adams, E ^a   Burnham, J ^a   Rodbell, K ^b  

^a IBM MICROELECTRONICS   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; ELECTRIC RESISTANCE; ELECTROMIGRATION; LEAKAGE CURRENTS; RELIABILITY ANALYSIS; TANTALUM COMPOUNDS;

ELECTROMIGRATION LIFETIME; IMPLANT DOSE; SURFACE CONCENTRATION; WIRE RESISTANCE;

OPTICAL INTERCONNECTS;

EID: 34748904858     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382340     Document Type: Conference Paper

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