Strategies of RC delay reduction in 45 nm BEOL technology

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 178-180

  Kudo, H ^a   Ochimizu, H ^a   Tsukune, A ^a   Okano, S ^a   Naitou, K ^a   Sakamoto, M ^a   Takesako, S ^a   Shirasu, T ^a   Asneif, A ^a   Idani, N ^a   Sugimoto, K ^a   Ozaki, S ^a   Nakata, Y ^a   Owada, T ^a   Watatani, H ^a   Ohara, N ^a   Ohtsuka, N ^a   Sunayama, M ^a   Sakai, H ^a   Oryoji, M ^a   Akiyama, S ^a   Iwata, H ^a   Yamamoto, H ^a   Shimoda, Y ^a   Yao, T ^a   Suda, S ^a   Suzuki, T ^a   Sakai, S ^a   Kitada, H ^a   Amari, S ^a   Tabira, T ^a   Matsuura, A ^a   Iba, Y ^a   Mizushima, Y ^a   Matsuyama, H ^a   Suzuki, Y ^a   Shimizu, N ^a   Yanai, K ^a   Nakaishi, M ^a   Futatsugi, T ^a   Hanyu, I ^a   Nakamura, T ^a   Sugii, T ^a   more..

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC FILMS; PERMITTIVITY; TIME DELAY; ULTRATHIN FILMS;

BEOL TECHNOLOGY; DELAY REDUCTION; ULTRA-THINNED BARRIER METAL;

NANOTECHNOLOGY;

EID: 34748902017     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382383     Document Type: Conference Paper

References (3)

1. H. Kudo, et al., Proc. IITC, 270 (2000).
2. H. Sakai et al., MRS Adv. Metallization Conf., 33 (2006).
3. I. Sugiura, et al., Proc. IITC, session No. 2.5 (2005).