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Volumn , Issue , 2007, Pages 563-568

Reliability of high temperature inverters for HEV

Author keywords

High temperature electronics; Hybrid electrical vehicle (HEV); Life time prognosis; Power electronic devices; Reliability

Indexed keywords

AUTOMOTIVE INDUSTRY; COMPUTATIONAL COMPLEXITY; ELECTRIC VEHICLES; HIGH TEMPERATURE ENGINEERING; POWER ELECTRONICS; RELIABILITY THEORY;

EID: 34748900001     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PCCON.2007.373022     Document Type: Conference Paper
Times cited : (11)

References (12)
  • 5
    • 34748875445 scopus 로고    scopus 로고
    • Hochtemperatur Leistungselektronik - der Weg zum Antriebsmodul für Hybridfahrzeuge der Zukunft, 12. VDI Kongress Elektronik im Kraftfahrzeug, Baden Baden 2005
    • F. Renken, V. Karrer, R. Knorr and E. Wolfgang, "Hochtemperatur Leistungselektronik - der Weg zum Antriebsmodul für Hybridfahrzeuge der Zukunft", 12. VDI Kongress Elektronik im Kraftfahrzeug, Baden Baden 2005, Deutschland.
    • Deutschland
    • Renken, F.1    Karrer, V.2    Knorr, R.3    Wolfgang, E.4
  • 6
    • 34748863103 scopus 로고    scopus 로고
    • High-Temperature Power Electronics: Challenges and Opportunities
    • VDE Verlag ISBN 3-8007-2704-8
    • E. Wolfgang, N. Seliger, G. Lugert and T. Riepl, "High-Temperature Power Electronics: Challenges and Opportunities," CIPS 2002, Proceeding: VDE Verlag ISBN 3-8007-2704-8
    • CIPS 2002, Proceeding
    • Wolfgang, E.1    Seliger, N.2    Lugert, G.3    Riepl, T.4
  • 8
    • 0032083947 scopus 로고    scopus 로고
    • S. Ramminger, P. Türkes, and G. Wachutka, Crack Mechanism in Wire Bonding Joints, ESREF 1998, Copenhagen, Denmark, Proceedings: pp. 1301-1305.
    • S. Ramminger, P. Türkes, and G. Wachutka, "Crack Mechanism in Wire Bonding Joints", ESREF 1998, Copenhagen, Denmark, Proceedings: pp. 1301-1305.
  • 11
    • 84971384269 scopus 로고    scopus 로고
    • S. Ramminger and G Wachutka, Predicting the Crack Progression in PbSnAg Solder under Cyclic Loading, CIPS 2006, Proc: VDE Verlag ISBN3-8007-2972-5.
    • S. Ramminger and G Wachutka, "Predicting the Crack Progression in PbSnAg Solder under Cyclic Loading," CIPS 2006, Proc: VDE Verlag ISBN3-8007-2972-5.
  • 12
    • 0042512018 scopus 로고    scopus 로고
    • N. Seliger, E. Wolfgang, G. Leftrance, H. Berg and T. Licht, Reliable Power Electronics for Automotive Applications, Microelectronics Reliability 42 2002, Proceedings: pp. 1597-1604
    • N. Seliger, E. Wolfgang, G. Leftrance, H. Berg and T. Licht, "Reliable Power Electronics for Automotive Applications", Microelectronics Reliability 42 2002, Proceedings: pp. 1597-1604


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.