Effects of Ni on the performance of Sn2.5Ag0.7Cu0.1RE solder alloy and its solder joints

Tezhong Zhuzao Ji Youse Hejin/Special Casting and Nonferrous Alloys

Volumn 27, Issue 8, 2007, Pages 651-653

  Fan, Yanli ^a   Zhang, Keke ^a   Wang, Yaoli ^a   Zhu, Yaomin ^a   Zhang, Xin ^a   Yan, Yanfu ^a  

^a HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Creep Rupture Life; Sn2.5Ag0.7Cu0.1RexNi Solder; Solder Joints; Tensile Strength, Elongation

Indexed keywords

EID: 34648825778     PISSN: 10012249     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)