Heat flux and slip effects on liquid flow in a microchannel

International Journal of Thermal Sciences

Volumn 46, Issue 11, 2007, Pages 1076-1083

  Ngoma, Guyh Dituba ^a   Erchiqui, Fouad ^a  

^a UNIVERSITÉ DU QUÉBEC EN ABITIBI TÉMISCAMINGUE   (Canada)

Author keywords

Heat transfer; Microchannel; Microfluidics; Modeling and simulation; Slip flow

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; ELECTRIC POTENTIAL; ELECTROOSMOSIS; FLOW OF FLUIDS; HEAT TRANSFER; MICROCHANNELS; MICROFLUIDICS; NAVIER STOKES EQUATIONS; NUMERICAL METHODS;

SLIP COEFFICIENTS; SLIP FLOW;

HEAT FLUX;

EID: 34548854765     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2007.02.001     Document Type: Article

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