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Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1730-1734

Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; FAILURE ANALYSIS; HEAT RESISTANCE; PARAMETER ESTIMATION; SHORT CIRCUIT CURRENTS;

EID: 34548693886     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.07.049     Document Type: Article
Times cited : (10)

References (9)
  • 1
    • 0034822511 scopus 로고    scopus 로고
    • Takata L. Destruction mechanism of PT and NPT-IGBTs in the short circuit operation - an estimation from the quasi-stationary simulations. In: International symposium on power semiconductor devices conference; 4-7 June 2001. p. 327-30.
  • 2
    • 34548699420 scopus 로고    scopus 로고
    • Laska T et al. Short circuit properties of trench/field-stop IGBT's design aspects for a superior robustness. In: Proceedings of the international symposium on power semiconductor devices conference; 2003. p. 173-6.
  • 3
    • 0031673050 scopus 로고    scopus 로고
    • Investigation of the short-circuit performance of an IGBT
    • Trivedi M., et al. Investigation of the short-circuit performance of an IGBT. IEEE Trans Electron Dev 45 1 (1998) 313-320
    • (1998) IEEE Trans Electron Dev , vol.45 , Issue.1 , pp. 313-320
    • Trivedi, M.1
  • 4
    • 0032777935 scopus 로고    scopus 로고
    • Failure mechanisms of IGBTs under short-circuit and clamped inductive switching stress
    • Trivedi M., et al. Failure mechanisms of IGBTs under short-circuit and clamped inductive switching stress. IEEE Trans Power Electron 14 1 (1999) 108-116
    • (1999) IEEE Trans Power Electron , vol.14 , Issue.1 , pp. 108-116
    • Trivedi, M.1
  • 5
    • 13444267421 scopus 로고    scopus 로고
    • Experimental behavior of single-chip IGBT and COOLMOS devices under repetitive short-circuit conditions
    • Lefebvre S., et al. Experimental behavior of single-chip IGBT and COOLMOS devices under repetitive short-circuit conditions. IEEE Trans Electron Dev 52 2 (2005)
    • (2005) IEEE Trans Electron Dev , vol.52 , Issue.2
    • Lefebvre, S.1
  • 6
    • 4544338854 scopus 로고    scopus 로고
    • Investigation of IGBT turn-on failure under high applied voltage operation
    • Ishiko M., et al. Investigation of IGBT turn-on failure under high applied voltage operation. Microelectron Reliab 44 9-11 (2004) 1431-1436
    • (2004) Microelectron Reliab , vol.44 , Issue.9-11 , pp. 1431-1436
    • Ishiko, M.1
  • 7
    • 48349133854 scopus 로고    scopus 로고
    • Benmansour A et al. Failure mechanisms of trench IGBT under various short-circuit conditions. Accepted at power electronics specialists conference, Orlondo, USA; 2007.
  • 8
    • 33747789373 scopus 로고    scopus 로고
    • Failure mechanism of trench IGBT under short-circuit after turn-off
    • Benmansour A., et al. Failure mechanism of trench IGBT under short-circuit after turn-off. Microelectron Reliab 46 9-11 (2006) 1778-1783
    • (2006) Microelectron Reliab , vol.46 , Issue.9-11 , pp. 1778-1783
    • Benmansour, A.1
  • 9
    • 34548685952 scopus 로고    scopus 로고
    • ISE TCAD Software, V10.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.